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...uit]]s. <ref> Rao R. Tummala et al, ''Microelectronics Packaging Handbook: Semiconductor packaging'', Springer, 1997 {{ISBN|0-412-08441-4}}, page 8-75 </ref> ...elf-supporting beam leads or internal chiplets [[cantilever]]ed beyond the semiconductor material. These contacts not only served as electrical leads but also provi ...

'''Glossary of [[microelectronics]] [[Semiconductor device fabrication|manufacturing]] terms''' ...rcuit|3D integration]]''' – an advanced [[Semiconductor device fabrication|semiconductor]] technology that incorporates multiple layers of [[Electronic circuit|circ ...

...of microscopic gears fabricated on a microchip would be considered a MEMS device but a tiny laser-machined stent or watch component would not). In Europe, t ...and process, and most likely a completely different [[fabrication (metal)|fabrication]] facility and engineering team. ...

...e memory arrays produced the "shmoo" shape and the term continued into the semiconductor era. ...oprocessors. The plot usually shows the range of conditions in which the [[device under test]] operates (in adherence with some remaining set of specificatio ...

...8-1101}}</ref><ref>{{Cite patent|number=WO2000077533A3|title=Semiconductor device simulation method and simulator|gdate=2001-04-26|invent1=Lui|inventor1-firs ...es involves an iterative process that crosses boundaries of technology and device development, product design and quality assurance. Modeling and simulation ...

...ion ( IR ) striking the sensor produces a change in the temperature of the device that as a consequence generates an electric output signal proportional to t == Fabrication process == ...

...or aging|one of the mechanisms]] that adversely affects the [[Reliability (semiconductor)|reliability of semiconductors]] of solid-state devices.<ref name=KK2011>{{ ...term “hot carrier injection” usually refers to the effect in [[Metal–Oxide–Semiconductor Field-Effect Transistor|MOSFET]]s, where a carrier is injected from the con ...

...ally applied, it charges the capacitor, which acts as a short term storage device to keep the output at an acceptable level while the PDC waveform is at a lo ...Carbon Sputter Issues}}</ref> and for increasing yield in [[semiconductor fabrication]] by reducing [[electrostatic]] build-up.<ref>{{Cite web | url=http://www.f ...

...istic|current–voltage (I–V) relationship]] of [[Diode#Semiconductor diodes|semiconductor diodes]] in moderate [[constant current]] [[forward bias]] or [[reverse bia ...nding on the [[fabrication process]] and [[List of semiconductor materials|semiconductor material]]. The ideality factor was added to account for imperfect [[P–n ju ...

...rchive-date=2016-08-22}}</ref> Following the introduction of [[metal–oxide–semiconductor]] (MOS) dynamic [[random-access memory]] ([[DRAM]]) chips in the early 1970 ...s]] introduced a 4{{nbsp}}[[Mebibit|Mb]] FeRAM chip [[semiconductor device fabrication|fabricated]] using [[NMOS logic]].<ref name="Scott">{{cite book |last1=Scot ...

...onal use of [[active component|active]] components such as [[semiconductor device]]s to amplify and control electric current flow. Previously electrical engi ...]s from a [[antenna (radio)|radio antenna]] possible with a non-mechanical device. The growth of electronics was rapid. By the early 1920s, commercial radio ...

...ield was pioneered by a number of investigators throughout the fledgling [[semiconductor]] industry. One of the most important engineering studies was performed by ...electromigration (EM) continues to be an ever-present challenge to device fabrication, and therefore the EM research for copper interconnects is ongoing (though ...

...ical sensors picking up in the 1960s with the demonstration of metal-oxide semiconductor sensors capable of sensing analyses such as oxygen.<ref>{{Cite journal|last ...mework|covalent-organic]] frameworks.<ref name=":0" /> One of the simplest device architectures for an electronic chemical sensor is a [[chemiresistor]], and ...

...every electronic device is a [[printed circuit board|PCB]] onto which the semiconductor and other components are mechanically and electrically connected by solderi ...test points, component [[bill of materials]], [[component placement]] and fabrication data. ...

...avalanche [[photo diode]], LASERs. Device technology: integrated circuits fabrication process, oxidation, diffusion, ion implantation, photolithography, n-tub, p ...]]s. Sample and hold circuits, [[Analog-to-digital converter|ADC]]s, DACs. Semiconductor memories. [[Microprocessor]] (8085): architecture, programming, memory and ...

[[Charge-coupled device]] – [[Covert listening device]] – ...

...earliest attempts to reduce the amount of power required by an electronic device were related to the development of the [[wristwatch]]. Electronic watches r ...uminating Arrangement for a Field-Effect Liquid-Crystal Display as well as Fabrication and Application of the Illuminating Arrangement'', filed 15 October 1976.</ ...

...p;mm), although components arranged in arrays (e.g., [[digital micromirror device]]s) can be more than 1000&nbsp;mm².<ref>{{Cite book|url=https:// ...ctical once they could be fabricated using modified [[semiconductor device fabrication]] technologies, normally used to make [[electronics]].<ref>{{Cite journal|v ...

...sical, biological, and [[chemical sensors]]. The name derives from typical device dimensions in the [[nanometer]] range, leading to low mass, high mechanical ...1–62 |url=https://ieeexplore.ieee.org/document/4480422}}</ref> [[Multigate device|Multi-gate MOSFETs]] enabled [[MOSFET scaling|scaling]] below [[22 nm proce ...

...ackwood to describe an effect proposed for designing a new type of display device for which they received a patent.<ref>{{cite journal |last1=Beni |first1=G. ...rowetting’.<ref>S. Arscott and M. Gaudet "Electrowetting at a liquid metal–semiconductor junction" Appl. Phys. Lett. 103, 074104 (2013). {{doi|10.1063/1.4818715}}.< ...