Deutsch: Aufnahme eines Ausfallortes verursacht durch Elektromigration in einer Kupferleiterbahn unter dem Rasterelektronenmikroskop (REM). Die Passivierung wurde vorher durch w:de:Plasmaätzen (RIE) und w:de:Fluorwasserstoffsäure (HF) entfernt. Die Ätzprozesse sind dabei nicht erprobt gewesen und beruhen auf Versuchen das bestmögliche Resultat zu erlangen.
English: SEM image of a failure caused by electromigration in a copper interconnect. The passivation has been removed by RIE and HF
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{{Information| |Description=Aufnahme eines Ausfallortes verursacht durch Elektromigration in einer Kupferleiterbahn unter dem Rasterelektronenmikroskop (REM). Die Passivierung wurde vorher durch w:de:Reactive Ion Etching (RIE) und [[w:de:Fluorwasserst