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- ...humb|Cross sectional view of a silicon wafer after metal assisted chemical etching (MACE). The dissolution rate of silicon is locally enhanced due to silver n ...irst4=Johannes |last5=Gösele |first5=Ulrich |title=Metal‐Assisted Chemical Etching of Silicon: A Review: In memory of Prof. Ulrich Gösele |journal=Advanced Ma ...18 KB (2,640 words) - 22:38, 10 December 2023
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- ...humb|Cross sectional view of a silicon wafer after metal assisted chemical etching (MACE). The dissolution rate of silicon is locally enhanced due to silver n ...irst4=Johannes |last5=Gösele |first5=Ulrich |title=Metal‐Assisted Chemical Etching of Silicon: A Review: In memory of Prof. Ulrich Gösele |journal=Advanced Ma ...18 KB (2,640 words) - 22:38, 10 December 2023
- ...ial)|conductive]] pathways, tracks or [[signal trace|trace]]s [[industrial etching|etch]]ed from copper sheets [[laminated]] onto a non-conductive ''substrate ...2 KB (324 words) - 03:37, 17 December 2023
- ...ing steps from the creation of metal interconnect layers through the final etching step that creates pad openings (see also front end of line, far back end of * '''[[deep reactive-ion etching]] (DRIE)''' – process that creates deep, steep-sided holes and trenches in ...14 KB (1,872 words) - 11:55, 18 October 2023
- # Selective Removal of Material Using Cathodic Sputtering (Plasma Etching/RIE), US Patent #3,271,286; issued 1966 ...3 KB (391 words) - 19:09, 9 October 2023
- ...This can be done by physically pulling the wires apart or through chemical etching or [[electromigration]].<ref>{{cite web |url=http://lifesciences.ieee.org/a ...4 KB (619 words) - 00:30, 4 December 2021
- ...[Tetramethylammonium hydroxide|TMAH]]) and [[dry etching]] ([[Reactive-ion etching|RIE]] and DRIE), [[electrical discharge machining]] (EDM), and other techno ...y)|deposition]] of material layers, patterning by [[photolithography]] and etching to produce the required shapes.<ref>{{cite book|title=MEMS Materials and Pr ...44 KB (6,295 words) - 20:04, 4 March 2024
- ...wafer, microscopic inspection of brand marks and trademarks, and laser die etching. ...6 KB (732 words) - 21:28, 2 January 2024
- * [[Etching]] ...5 KB (726 words) - 00:56, 28 November 2023
- ...r and professor Roger Angel. Angel has developed a diffraction pattern by etching onto a lens, which will deflect the Sun's rays. ...6 KB (959 words) - 18:36, 6 September 2023
- ...bulk, and examining the flat section using [[optical microscopy]] after [[etching]] solutions have been used to provide contrast in the section between alloy ...8 KB (1,144 words) - 14:05, 6 February 2024
- ...are not affected by the fluorine [[Plasma etching|plasma]], used to [[Dry etching|dry etch]] [[silicon]] and interlevel [[Dielectric|dielectrics]]. The use o ...17 KB (2,486 words) - 22:08, 10 January 2024
- **[[Etching]] ...9 KB (1,132 words) - 08:16, 7 August 2023
- ...049795.jpg|thumb|A raggedly dressed man being bitten by a house guard dog. Etching by [[Thomas Lord Busby]], ca. 1826.]] ...10 KB (1,467 words) - 15:38, 3 March 2024
- ...rred to the [[Substrate (materials science)|substrate]] material, often by etching. It was originally developed for manufacturing integrated circuits and is a ...9 KB (1,242 words) - 16:23, 2 August 2023
- ...cturing]], especially for high density [[DRAM]] memories, through [[plasma etching]] or other [[plasma processing]] technologies, ...9 KB (1,395 words) - 22:22, 13 July 2023
- ...in development and in need of improvement. Furthermore, the chemistry and etching characteristics of most piezoelectric materials remain very slow.<ref name= ...11 KB (1,386 words) - 04:51, 22 July 2023
- ...tors onto linen paper in 1904. Arthur Berry in 1913 patented a print-and-[[Etching|etch]] method in the UK, and in the United States [[Max Schoop]] obtained a ...t=Stanislaus F.}}</ref> With the development of board [[lamination]] and [[etching]] techniques, this concept evolved into the standard printed circuit board ...85 KB (12,615 words) - 18:01, 29 February 2024
- ...nd technologies, such as [[plasma display|plasma televisions]] or [[plasma etching]].<ref name="Itptma2013">{{cite book ...free }}</ref> surface treatments such as [[plasma spraying]] (coating), [[etching]] in microelectronics,<ref name="NRC">{{cite book |author= National Researc ...62 KB (8,752 words) - 15:27, 13 February 2024
- ...value is determined by cutting a helix through the coating rather than by etching, similar to the way carbon resistors are made. The result is a reasonable t ...27 KB (3,924 words) - 12:44, 21 June 2023
- ...oys as resistance wire elements, but are produced with a subtractive photo-etching process that starts with a continuous sheet of metal foil and ends with a c ...30 KB (4,246 words) - 13:26, 3 February 2024
