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- {{short description|Technology used to deposit metal beams onto integrated circuits for connecting them}} ...lectroformed beam leaded integrated circuit.png|thumb|Beam lead integrated circuits]] ...3 KB (391 words) - 19:09, 9 October 2023
- ...e at a specific frequency. They find applications in [[electronics]], in [[integrated circuit]]s.<ref>{{cite web|url=https://www.slideshare.net/pilurout/hgu|titl ...1 KB (129 words) - 23:14, 3 January 2023
- ...or even more than a thousand for the largest [[ball grid array]] packages. Integrated circuit pins often either bend under the package body like a letter "J" (J- ...used for surface mount packages with leads – such as [[Small Outline Integrated Circuit]] [[Quad Flat Package]] – and for through-hole packages such ...4 KB (646 words) - 06:37, 21 January 2024
- ...rcuits are low current and potentially high voltage, whereas low impedance circuits are the opposite (low voltage and potentially high current). Numerical defi In [[Analog electronics|analog circuits]] a high impedance node is one that does not have any low impedance paths t ...4 KB (597 words) - 00:26, 26 February 2024
- ...limit the movement of the carriers in the material.<ref>''GaAs Devices and Circuits'', Michael Shur, pp. 310-324, Plenum Press, NY 1987, {{ISBN|0-306-42192-5}} ...stors]], which are basic building blocks of almost all modern [[integrated circuits]]. Typical values of saturation velocity may vary greatly for different ma ...6 KB (846 words) - 10:19, 13 April 2023
- ...it thereby providing additional safety. Such an arrangement would apply to circuits that inter-connect power distribution systems where both ends of the circui ===Integrated disconnecting switch=== ...5 KB (721 words) - 12:27, 28 December 2023
- ...er (with V&I Labels).svg|thumb|right|[[series and parallel circuits#Series circuits|Series]] RC circuit]] In more complicated circuits consisting of more than one resistor and/or capacitor, the [[open-circuit t ...6 KB (895 words) - 20:24, 26 February 2024
- ...devices]] modules, [[hybrid integrated circuit]]s, [[heating element]]s, [[integrated passive devices]] and [[sensor]]s. Main manufacturing technique is screen p ...irst1=B. |title=2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference |chapter=Thick film hybrid technology for automotive ...13 KB (1,820 words) - 07:36, 28 December 2023
- ...nberg, M.|title=A Nonlinear GaAs FET Model for Use in the Design of Output Circuits for Power Amplifiers | journal = IEEE Transactions on Circuits and Systems ...11 KB (1,632 words) - 23:21, 4 August 2023
- * '''[[2.5D integrated circuit|2.5D integration]]''' – an advanced integrated circuit packaging technology that bonds dies and/or chiplets onto an interp ...es multiple layers of [[Electronic circuit|circuitry]] into a single chip, integrated both vertically and horizontally ...14 KB (1,872 words) - 11:55, 18 October 2023
- ...ly the result of a [[Electrical fault|fault]], there are cases where short circuits are caused intentionally, for example, for the purpose of voltage-sensing [ ...e is no resistance and thus no voltage drop across the connection. In real circuits, the result is a connection with almost no resistance. In such a case, the ...10 KB (1,412 words) - 23:20, 29 January 2024
- ...ant frequencies]] and potential for integration with supporting electronic circuits especially for miniaturized high frequency applications. ...2 KB (284 words) - 13:38, 4 August 2023
- ...|location=Switzerland |pages=279–280 |language=English}}</ref> in [[Maxim Integrated|2021]]. ...cameras were [[FPD-Link]] from National Semiconductor and GMSL from Maxim Integrated. GMSL was introduced in 2008, and supported up to 3.125 Gb/s data rate in t ...7 KB (954 words) - 20:01, 29 January 2024
- ...messages between two systems, which uses permanent directly connected data circuits between the systems. The IEC TC 57 WG3 have developed a [[Communications pr ...-5-102 Transmission Protocols - Companion standard for the transmission of integrated totals in electric power systems (this standard is not widely used) ...5 KB (680 words) - 13:41, 1 January 2024
- ...etwork equations using Laplace transform: frequency domain analysis of RLC circuits. 2-port network parameters: driving point and transfer functions. State equ ===Electronic devices and circuits=== ...10 KB (1,343 words) - 11:26, 2 March 2023
- ...OI processor SoC |title=ESSCIRC Conference 2016: 42nd European Solid-State Circuits Conference |pages=269–272 |year=2016 |last1=Keller |first1=Ben |last2=Coche ...Bharadwaj|date=2011|title=Adaptative Techniques to Reduce Power in Digital Circuits|journal=Journal of Low Power Electronics and Applications|language=en|volum ...13 KB (1,854 words) - 16:39, 2 August 2022
- *if heat is produced in more than expected amount (such as in cases of short-circuits, or applying more voltage than rated), or Sometimes, special circuits are built for the purpose of sensing and controlling the temperature or vol ...9 KB (1,232 words) - 23:21, 30 December 2023
- ...thumb|Hierarchy of technology CAD tools building from the process level to circuits. Left side icons show typical manufacturing ...hecking#Design Rules|design rules]] are essential building blocks of the [[integrated circuit design]] process. Their accuracy and robustness over process techn ...14 KB (2,069 words) - 08:37, 21 February 2024
- ...d-state circuit elements were required to achieve the scalability of the [[integrated circuit]] which was gaining popularity around the same time as the inventio [[Category:Electronic circuits in computer storage]] <!-- exact wording may be wrong --> ...3 KB (486 words) - 09:58, 6 November 2023
- ...radial-leaded parts (e.g. [[LED]]s and [[electrolytic capacitor]]s) and [[integrated circuit]]s is done in the same manner except the parts are already formed i [[File:Integrated Circuit.jpg|thumb|Components like [[integrated circuit]]s can have upwards of dozens of leads, or ''pins'']] ...10 KB (1,375 words) - 17:28, 15 February 2024