Search results

{{short description|Technology used to deposit metal beams onto integrated circuits for connecting them}} ...uit]]s. <ref> Rao R. Tummala et al, ''Microelectronics Packaging Handbook: Semiconductor packaging'', Springer, 1997 {{ISBN|0-412-08441-4}}, page 8-75 </ref> ...

...es the end of the traditional "[[happy scaling]]" paradigm, where [[CMOS]] technology and CMOS design evolved on formally separate tracks, the interface between Today, both sides ([[design]] and [[technology]]) are confronted with the need to understand the other in order to overcom ...

...le/133186/download Stochastic Signal Density Modulation Datasheet] Cypress Semiconductor (Jul 24, 2014)</ref> ...cypress.com/file/125321/download 16-Bit Hardware PrISM Datasheet ] Cypress Semiconductor (Mar 3, 2014)</ref> For a 4-bit LFSR the sequence is [1 2 5 3 7 6 4]. If t ...

[[Japanese Industrial Standards]] (JIS) has standard '''JIS-C-7012''' for semiconductor part numbers. The first digit denotes the ''p-n junction count'' ("3" may a ! 2nd letter !! Type of semiconductor ...

'''Glossary of [[microelectronics]] [[Semiconductor device fabrication|manufacturing]] terms''' ...d circuit|2.5D integration]]''' – an advanced integrated circuit packaging technology that bonds dies and/or chiplets onto an interposer for enclosure within a s ...

[[File:TCAD-overview.JPG|400px|right|thumb|Hierarchy of technology CAD tools building from the process level to circuits. Left side icons show ...ronic design automation for IC implementation, circuit design, and process technology |date=2016 |others=Luciano Lavagno, Igor L. Markov, Grant Martin, Lou Schef ...

'''Pulsed power''' is the science and technology of accumulating [[energy]] over a relatively long period of time and releas ...91/c12573e7003304adc1256b820064c480.aspx ABB Pulsed Power] Manufacturer of semiconductor-based replacements for thyratrons ...

{{short description|Technology with features near one micrometre}} '''Microtechnology''' is [[technology]] whose features have dimensions of the order of one [[micrometre]] (one mi ...

{{Short description|Technology abandoned by the original developers}} ...ebsite=resilience |language=en-US}}</ref> Unlike [[abandonware]], orphaned technology refers to both [[software]] and [[Computer hardware|hardware]] and the prac ...

{{Short description|Most advanced technology available}} ...ight|Automotive [[BMW]] plant using [[industrial robot|industrial robotics technology]] in [[Leipzig]], Germany]] ...

...le=Another "missing" component could revolutionize electronics|website=MIT Technology Review}}</ref> Since then, it has been distributed and discussed by many ot [[Category:Semiconductor devices]] ...

...'''76''' (24): 4508–4511. [[doi:10.1103/PhysRevLett.76.4508]]</ref> where semiconductor electrons move through the [[Brillouin zone]], just to return to where they ...ultrafast processes in semiconductors or to produce ultrafast switching in semiconductor components. Obviously, the combination of ultrafast duration and strong pea ...

|journal = Power Electronics Technology ...s/88440/failurem.pdf | publisher = [[Vishay Intertechnology|Vishay General Semiconductor]] | date = 13 August 2007 | access-date = 8 June 2012 }}</ref> ...

...engineering]] (includes microelectronics engineering, microelectronics and semiconductor engineering) ** [[Military technology]] ...

...//www.technologyreview.com/energy/23959/|archive-date=2012-01-19|website=[[Technology Review]]|publisher=MIT}}</ref> ...rt.grc.nasa.gov/power-in-space-propulsion/photovoltaics-power-technologies/technology-thrusts/alpha-and-beta-voltaics/ |date=2011-10-18 }} (accessed October 4, 2 ...

In [[electronics]], '''through-hole technology''' (also spelled "'''thru-hole'''") is a manufacturing scheme in which [[le ...rdware|second generation of computers]] in the 1950s until [[surface-mount technology]] (SMT) became popular in the mid 1980s, every component on a typical PCB w ...

{{Short description|Automotive high speed video link technology}} ...itle=Handbook of Camera Monitor Systems, The Automotive Mirror-Replacement Technology based on ISO 16505 |publisher=[[Springer Publishing Company|Springer]] |yea ...

...rovided the basis for a variety of novel and specialized applications in [[semiconductor]] manufacturing, [[microelectromechanical systems]], [[nanoelectromechanica ...an excellent tool in heating applications, such as welding. Electron beam technology is used in cable-isolation treatment, in electron lithography of sub-microm ...

...''[[Fortune (magazine)|Fortune]]'' as being in the [[technology companies|technology sector]], ranked by total annual [[revenue]]. Other metrics not shown here, ...ry, which includes [[computer hardware]], [[software]], [[electronics]], [[semiconductor]]s, [[Telecommunications equipment|telecom equipment]], [[e-commerce]] and ...

...g]] type (i.e. whether it is a [[P-type semiconductor|P-type]] or [[N-type semiconductor|N-type]] material) ...ple with a hole by the van der Pauw method|journal=Measurement Science and Technology|date=2015|volume=26|issue=5|pages=055003|doi=10.1088/0957-0233/26/5/055003| ...